Chemicals for use in electroless plating and electroplating processes; chemical compositions for metal plating; pre-treatment preparations for plating; trivalent chromate finishing and coating preparations for plating; metal chlorides; chemicals for use in semiconductor manufacture, semiconductor device fabrication and semiconductor packaging; electroplating chemicals; chemicals for wafer level semiconductor packaging processes; chemicals for panel level semiconductor packaging processes; chemicals for fan out wafer level semiconductor packaging processes; chemicals for fan out panel level semiconductor packaging processes; chemicals for use in the circuit board industry, namely, peroxide and sulfuric acid based etchants and oxidants for roughening or etching copper surfaces prior to multilayer lamination of printed wiring boards; chemicals used in industry; adhesives for use in electronics industry; non-conductive adhesives for use in electronics industry; unprocessed epoxy resins for use in electronics industry; industrial adhesives used in the assembly, maintenance and repair of electronics for use in electronics industry; fillers for use with electronic components, namely, unprocessed epoxy resins for use as underfill; unprocessed epoxy resins; chemicals, namely, soldering flux; industrial chemicals used for cleaning circuit boards and surface mount devices; industrial adhesives, unprocessed artificial resins, unprocessed synthetic resins, unprocessed epoxy resins for bonding, wetproofing, coating, encapsulation, sealing, molding, waterproofing, moisture proofing, heatproofing, solder joint attachment applications in the electronics industry.;